Artificial intelligence chips are bonded with microscopic precision
To create the world's fastest memory, specialized machines must stack and fuse silicon layers using heat and pressure with near-perfect accuracy.
Modern artificial intelligence requires a specialized type of memory called High Bandwidth Memory, or HBM. To create it, engineers do not just place chips side-by-side on a circuit board. Instead, they stack individual layers of dynamic random-access memory vertically, like a skyscraper of silicon. This vertical architecture allows data to travel much shorter distances, drastically increasing the speed at which a processor can access information.
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